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Solder Paste Inspection
True 3D SPI, the Best Partner for Smart Factory
Successful process optimization for high yields depends on accurate inspection technology and analysis tools. Emerging challenges in packaging and assembly demand more capable, precise and reliable inspection.
Accurate, whole measurement of every tiny objects such as 03015, requires true three-dimensional inspection.
Only Koh Young brings you true 3D shadow-fee inspection in a powerful hardware/software package, so that you can optimize your process.
Learn why one in two SPIs installed today is from Koh Young.
> The highest standard in 3D inspection based on True patented 3D volume Measurement
> Highest measurement accuracy and inspection repeatability
> Active Warp Compensation
> On-the-fly Automated Solder Paste Dispensing: Auto-Rework
> Beyond solder paste inspection
> Self-Diagnosis for Optimal Performance Maintenance
> KSMART Solutions: True 3D Measurement-based Process Control System
> Zero-defect through AI-powered Koh Young Process Optimizer (KPO)
Why is the solder printing process so important?
Approximately 70% of defects in the SMT process are caused during printing process. These defects can be caused serious problems in the downstream stages if not corrected. Optimizing printing process is invaluable for achieving maximum yields and eliminating the root case of defects.
Why true 3D inspection is inevitable?
Solder paste printing is a 3-dimentional process. In order to accurately measure printed paste volume, 3D inspection technology is needed.
It’s the only way to ‘see’ print problems and get reliable information for SPC analysis and process control.
As solder paste deposits such as 03015, become smaller, they also become more irregular in shape and more difficult to inspect and measure accurately.
Yet because they are smaller, precise volume measurement is more critical than ever.
What is the Shadow Problem in 3D Inspection?
Even the best inspection system can’t measure what it can’t ’see’. Single-sided projection – the basis for traditional 2D inspection – leaves areas in shadow. Only Koh Young’s dual projection approach and proprietary vision algorithms eliminate all areas of irregularly-shaped objects (e.g., having peaks and valleys) so that the entire deposit can be accurately measured and analyzed.
Everything is visible, nothing is left to doubt. Dual or even quad projection, in combination with shadow-free Moiré technology, overcomes shadow and inclined surface specular problems to deliver accurate results every time.
The Highest Standard in 3D Inspection based on True Patented 3D Volume Measurement
We provide the 3D solder paste inspection equipment featuring the world’s leading measurement accuracy and inspection reliability. Accurate measurement data can be secured, and the optimization of printing process can be realized through Koh Young Technology’s patented technology that solves shadow and diffuse problems.
Warped PCBs? No Problem
Don’t let the occasional warped PCB slow you down or skew your result. The unique Koh Young warp compensation technology actively calculates and detects any PCB warpage. Using its exclusive 3D imaging and algorithms, Koh Young considers multiple elements like slope, stretch, twist, bow, and shrinkage to guarantee an accurate measurement and to meet the ultimate inspection system criteria.
What’s more? Real-time, automatic pad-reference teaching uses IR lighting to compensate for non-linear inspection challenges by analyzing the PCB and locations against the ideal PCB stencil design defined in the CAD file.
On-the-fly Automated
Solder Paste Dispensing: Auto-Rework
The high-precision and user-friendly dispensing system helps eliminate costly mistakes due in large part to insufficient solder in open joints, lean fillets, and weak joints. The automatic dispensing solution reduces operational costs, improve line efficiency, and strengthens profitability by eliminating board scrap and rework. Once Koh Young’s SPI is configured with the Auto-Rework solution, it becomes more than an inspection system. It becomes a true process optimizer.
Beyond Solder Paste Inspection
Inspection is not limited to just solder deposits. Koh Young’s SPI system provides whole-board foreign material inspection (WFMI), conductive glue, sinter paste inspection with full color image display results.
Self-Diagnosis for Optimal Performance Maintenance
Unscheduled downtime can cripple production. Self-Diagnosis allows operators to take precautionary measures through predictive maintenance in order to reduce process interruptions, enhance uptime, and ensure optimal machine performance.
The Self-Diagnosis feature comes with distinct modules which offers periodical machine checkups on critical items such as 3D/2D light intensity, PZT feed, height accuracy, and XY offset.
KSMART Solutions: True 3D Measurement-based
Process Control system
Koh Young is pioneered True 3D measurement technology 20 years ago to zero-defect future. This gave rise to KSMART Solutions and its continuous efforts to leverage data and connectivity.
KSMART Solutions uses Artificial Intelligence to help automate process control while focusing on data management, analysis, and optimization. It collects data from across the factory line for defect detection, real-time optimization, enhanced decisions, and traceability to improve metrics, increase quality, and lower costs by eliminating variance, false calls and escapes.
Zero-defect through AI-Powered Koh Young Process Optimizer (KPO)
Koh Young is driven to help customers achieve a Zero-defect print process scenario. The AI-powered Koh Young Process Optimizer (KPO) solution automatically exercises complex algorithms to develop and implement print process improvements.
By actively monitoring the print process, KPO sends operators real-time performance diagnostics and threshold alerts – it even implements process change automatically. KPO ensures real-time print process reliability without dedicated experts.
Fully Automated In-line Inspection Solution for
Extra-long Applications
Evolving applications like LED lighting, electronic vehicles (EVs), communications, and even storage can challenge manufacturers, especially in terms of board length. The new USX series allows manufacturers to efficiently inspect boards up to 1,300mm long in a single pass and can be optionally configured to handle boards up to 1,800mm long.
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