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ZenStar
Solutions / Industrial / SIS / ZenStar
The Most Optimized True 3D Inspection Solutions for Wafer-Level-Packaging Applications
ZenStar has been qualified for mass production by major semiconductor foundries for micro solder on wafer, shiny components and highly reflective components on substrates.
Meet ZenStar with multiple resolutions and configurable options to meet the needs of WLP applications.
Key Features
Paramount 3D Inspection Capability for Wafer-Level-Packaging Applications
Full 3D Height and Tilt Measurement Capability for Highly Reflective Components
Enhanced Inspection Capabilities with Proprietary AI & Vision Technology
Interworking with EFEM
Ring-frame Wafer Handling (with multi-load ports and dual arm robot)
Stable (Porous) Vacuum Chuck
Related Products
Meister D/D+
Breakthrough in 3D Measurement for High-Density Substrates & Shiny Components and Highly Reflective Components
