Close this search box.


Discover innovative solutions that reflect Koh Young’s latest technology.

Meister for WLP

Solutions / Industrial / SIS / Meister for WLP

The Most Optimized True 3D Inspection Solutions for Wafer-Level-Packaging Applications

The Meister Series for Wafer-Level Packaging has been qualified for mass production by major semiconductor foundries for micro solder on wafer, shiny components and highly reflective components on substrates.

Meet Meister Series for WLP with multiple resolutions and configurable options to meet the needs of WLP applications.

Key Features

Related Products