Close this search box.


Discover innovative solutions that reflect Koh Young’s latest technology.


Solutions / Industrial / SIS / Prime

The Most Optimized 3D In-line SPI Solution for Advanced Packaging

The Prime has been qualified for mass production by major OSAT companies for thin solder paste inspection with superior full 3D inspection performance.

Key Features

– Perfect solution to eliminate shadow and specular problems
– Highly reliable and accurate system

Related Products