Koh Young’s world-leading technologies
Best-in-Class Advanced Inspection Technology for Advanced Packaging & Mini-LED Applications
Today’s electronic devices are becoming more complex and therefore demand increased functionality and higher performance, while packaging more components into a smaller space for miniaturization.
Typical optical triangulation method cannot measure ultra-thin solder or mirror-surface components. The sensor on conventional systems simply struggle to accurately capture the reflected signal. With industry-leading vision technology with advanced high-resolution optics for semiconductor industries, Koh Young provides ultimate solutions for these challenges.
> Paramount True 3D Inspection Capability for Micro Solder Deposits and Shiny Components
> Breakthrough in 3D Measurement for Highly Reflective Components
> Qualified for Advanced Packaging & Mini-LED Applications
> Diverse Substrate and Carrier Handling Mechanisms
> Enhanced Capabilities with Proprietary AI & Vision Technology
> Zero-defect through AI-powered Koh Young Process Optimizer (KPO) for Printer & Mounter
> Autonomous Judgement and Classification (Smart Review)
Paramount True 3D Inspection Capability for Micro Solder Deposits and Shiny Components
Electronics manufacturers encountered enormous difficulties in inspecting micro solder deposits and shiny components using 2D and 3D technology. Koh Young overcomes these critical challenges in the manufacturing line by employing the best optomechatronics and machine vision technologies to secure verification of demanding failures of all kinds, including micro solder deposits with extremely narrow pitch and shinny & highly reflective components.
Breakthrough in 3D Measurement for Highly Reflective Components
Koh Young offers the most optimized 3D inspection solutions for highly-reflective die using an advanced optical design. The typical optical triangulation method cannot measure mirror-surfaced components. The sensor on conventional systems cannot accurately capture the reflected signal. Using our advanced optical design, the Meister D and D+ system can perfectly reconstruct the 3D shape of the mirror-surface die to inspect coplanarity, die crack, and even highly reflective die surfaces for full 3D height and tilt measurement.
Qualified for Advanced Packaging & Mini-LED Applications
Many OSAT, chip makers, display, and lighting manufacturers have been adopting Koh Young’s advanced inspection solutions for their production to overcome the inspection challenges, maximize production yield and reduce costs. These advanced inspection solutions from Koh Young are already proven with more than 400 installed units worldwide.
Diverse Substrate and Carrier Handling Mechanisms
Handling products at the Semicon-level manufacturing lines have proven to be a challenge. However, Koh Young provides handling solutions to support diverse substrate, carriers, and vacuum chuck.
Enhanced Capabilities with Proprietary AI & Vision Technology
Unparalleled in-house 2D and 3D multi-modal technology combining Moiré technology and new optics enables robust and stable inspection for bleeding-edge applications (such as highly reflective dies and Mini/Micro-LEDs.)
With its proprietary deep learning technology, the Meister D series offers enhanced inspection capabilities enabling robust inspection for LED polarity even under harsh production environments such as boards with warp.
Zero-defect through AI-Powered Koh Young Process Optimizer (KPO)
Koh Young is driven to help customers achieve a Zero-defect printing process scenario. The AI-powered Koh Young Process Optimizer (KPO) solution automatically exercises complex algorithms to develop and implement print process improvements.
By actively monitoring the print process, KPO sends operators real-time performance diagnostics and threshold alerts – it even implements process change automatically. KPO ensures real-time print process reliability without dedicated experts.
Autonomous Judgement and Classification (Smart Review)
Maximize production performance by reviewing defects from multiple lines and offering judgment history and help cards with auto-classified defect information.