Atlanta, Georgia – Koh Young, the industry leader in True 3D measurement-based inspection solutions, is excited to announce that Ramiro Mora, Application Team Leader for Mexico and South America, will present on solder paste print process capability analysis at the SMTA Guadalajara Expo and Tech Forum in Jalisco, Mexico, on September 11-12, 2024.

Statistical Process Control (SPC) is essential for real-time monitoring and control of processes. By utilizing statistical tools and charts, SPC helps detect changes, trends, and patterns in output over time. In the context of solder paste printing on printed circuit boards, SPC evaluates process performance to ensure quality and determine when adjustments are needed. The primary aim of SPC is to prevent issues before they arise, leading to significant savings and improvements in operations through data-driven decisions. 

“Effective SPC is crucial for optimizing the solder print process,” says Ramiro Mora. “By leveraging real-time data and statistical analysis, we can ensure consistent quality and address potential issues proactively before they impact production. SPC empowers manufacturers to make informed decisions, ultimately enhancing efficiency and reliability in manufacturing with data from our SPI machines.”

Following his presentation, Ramiro will be available for discussions at Koh Young booth 702, where we will also showcase the KY8030-3. We pioneered 3D measurement-based solder paste inspection, revolutionizing the inspection industry. Today, 3D SPI is a standard requirement for SMT lines, not an option. The KY8030-3 is our flagship SPI solution, renowned for its patented dual-projection technology that provides reliable and repeatable measurement data, enabling manufacturers to optimize their print processes effectively.

To learn more about how our solutions boost your quality, visit us at the SMTA Guadalajara Expo & Tech Forum during September 11-12, 2024 at the EXPO Guadalajara in Jalisco, Mexico. You can register to attend the in-person conference and exposition at www.smta.org/events. If you cannot attend the show, you can still learn more about our best-in-class inspection solutions at our website www.kohyoung.com

 


About Koh Young Technology

Established in 2002, Koh Young revolutionized the inspection market by launching the industry’s first 3D Solder Paste Inspection (SPI) system using a patented dual-projection Moiré technology. Since then, it has become the global leader in 3D measurement-based SPI and Automated Optical Inspection (AOI) equipment for the electronics industry. Based on its True3D™ measurement-based inspection technology, Koh Young has developed innovative inspection solutions for challenges with machined parts, press-fit and through-hole pins, conformal coatings, dispensed materials, and semiconductor packages. Through its constant innovation, Koh Young has secured over 3,700 global customers, and commands the dominant global market share position in the SPI and AOI markets with well over 23,000 machine installations. A customer-centric R&D focus uses our core competencies to develop innovative solutions for new and existing markets by listening to users and researching trends and applications. From the headquarters in Korea, activities spread across the world through its global sales and support infrastructure spanning Europe, Asia, and the Americas. These regional offices ensure Koh Young stays close to the market, and more importantly, its growing user base. Learn why so many electronics manufacturers trust Koh Young for reliable inspection at our website at www.kohyoung.com.