Koh Young Shares Revolutionary Advanced Package Inspection Solutions at the SMTA Wafer-Level Packaging Symposium in Burlingame, CA on 12 February 2024
Atlanta, Georgia – Koh Young Technology, the leader in True 3D measurement-based inspection solutions, will be speaking at the SMTA Wafer-Level Packaging Symposium in Burlingame, California on our Multimodal Phase Shift Optics Approach to revolutionize high-speed 3D reconstruction of semiconductor and advanced packages. In the presentation will highlight how high-speed 3D reconstruction addresses the growing […]
