Koh Young 8030 USX SPI for Ultra Large, Heavy Boards Wins the Global Technology Award at Productronica
Atlanta, Georgia – Koh Young Technology, the leader in True3D™ measurement-based inspection solutions, proudly announced the USX Series of inspection machines for ultra large and heavy boards wins another innovation award. This time, Global SMT & Packaging acknowledged the new 8030 USX SPI, part of the USX series of inspection machines designed for applications like […]
Koh Young USX Series of Inspection Machines for Ultra Large, Heavy Boards Wins Two Prestigious Awards during SMTA Guadalajara
Atlanta, Georgia – Koh Young Technology, the leader in True 3D measurement-based inspection solutions, proudly announced another pair of innovation awards. This time, Mexico EMS acknowledged the new USX Series of solder paste (SPI), automated optical inspection (AOI), and dispense process inspection (DPI) machines for ultra large, heavy boards with the coveted Editor’s Choice Award […]
