Tag: SPI

[US-TECH] Koh Young America’s Ray Welch Delivers 100th SPI Level 2 Print Process Training Class

Koh Young America’s Ray Welch Marks 100th Advanced Solder Paste Inspection and Print Process Training Class

Press Release Absolute No.1 Inspection Company Koh Young America’s Ray Welch Marks 100th Advanced Solder Paste Inspection and Print Process Training Class Milestone highlights Koh Young’s commitment to helping manufacturers turn SPI measurement data into better print processes Atlanta, Georgia – Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, is celebrating […]

Koh Young Highlighting its Award-winning Inspection Solutions at IPC APEX EXPO on April 09-11, 2024, in Anaheim, CA

Atlanta, Georgia – Koh Young, the industry leader in True 3D measurement-based inspection solutions and the Premier Sponsor of IPC APEX EXPO, invites electronics manufacturers to booth 2112 for live demonstrations of our award-winning inspection solutions. At the show, you can discover the future of inspection technology as Koh Young highlights innovative machines and smart […]

[I-Connect007] The Printed Circuit Assembler’s Guide to… ™ SMT Inspection: Today, Tomorrow, and Beyond

by: Brent Fischthal SMT Inspection from I-Connect007 https://iconnect007.com/my-i-connect007/books/inspection/ Currently, surface mount technology lines are monitored by two key inspection processes. The first, SPI, reviews the printed circuit board after the solder paste has been applied and before components are placed. The second, AOI, reviews the PCB assembly after the board has been assembled and reflowed […]