Koh Young Highlighting Dimensional Metrology & Inspection Solutions at theBinghamton University Electronics Packaging Symposium in Niskayuna, NY
Atlanta, GA – Koh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, is proud to announce its sponsorship and participation in the 36th Annual Electronics Packaging Symposium (EPS), hosted at the GE Aerospace Research Campus in Niskayuna, New York, on September 03-04, 2025. Organized by the Binghamton University Integrated Electronics […]
