Koh Young USX Series of Inspection Machines for Ultra Large, Heavy Boards Wins Two Prestigious Awards during SMTA Guadalajara

Atlanta, Georgia – Koh Young Technology, the leader in True 3D measurement-based inspection solutions, proudly announced another pair of innovation awards. This time, Mexico EMS acknowledged the new USX Series of solder paste (SPI), automated optical inspection (AOI), and dispense process inspection (DPI) machines for ultra large, heavy boards with the coveted Editor’s Choice Award […]