Shenzhen, China – Koh Young, the industry leader in True 3D measurement-based inspection solutions, will participate in NEPCON Asia 2022 at the Shenzhen World Exhibition and Convention Center from November 30 – December 2, 2022 in Shenzhen, China.
Koh Young will exhibit solutions at booth 13D010 (Hall 13). Specifically, we will highlight ten smart factory solutions that solve electronics assembly challenges:
- Neptune C+: Revolutionary True 3D In-Line Dispensing Process Inspection (DPI) Solution
- True 3D Profiling: Using patented technologies, the Neptune C+ is the industry’s first 3D in-line DPI and thickness measurement solution for transparent material inspection. The system allows manufacturers to explore the depths of its process and accurately find defects with 2D, 3D, and cross-section views.
- Bubble Inspection using AI-Powered Capabilities: With its proprietary machine learning technology, the Neptune C+ offers enhanced inspection capabilities enabling autonomous bubble inspection without teaching and endless tuning.
- Neptune T: Revolutionary True 3D Off-Line Dispensing Process Inspection (DPI) Solution
- Superior Performance – L.I.F.T Technology: The Koh Young L.I.F.T technology delivers non-destructive 3D inspection to precisely measure and inspects fluids that are wet or dry. This patented technology provides the most accurate and reliable 3D inspection across any surface – Smooth, uneven, or rough.
- Superior Performance – L.I.F.T Technology: The Koh Young L.I.F.T technology delivers non-destructive 3D inspection to precisely measure and inspects fluids that are wet or dry. This patented technology provides the most accurate and reliable 3D inspection across any surface – Smooth, uneven, or rough.
- KY8030-3: The Industry’s Fastest True 3D Solder Paste Inspection Solution
- Automated Solder Paste Dispensing: The KY8030-3 automatically dispenses paste with its Auto-Rework option. The high-precision and user-friendly dispensing system eliminate costly mistakes like insufficient solder causing open joints, lean fillets, and weak joints.
- Unmatched Inspection Speed: The KY8030-3 blends Koh Young’s pioneering technologies to provide unmatched inspection speeds. The combination of this system’s throughput and accuracy makes this solution suitable across a vast range of applications.
- Koh Young Process Optimizer (KPO): AI-Powered solution for Printers
- Ultimate Printing Process Reliability & Consistency: With increasing component miniaturization, improving inspection quality, and increasing the inspection system’s throughput, programming is paramount in the industry. Our AI-powered solution not only analyzes challenges in the printing process faced today in the industry, but also is prepared to solve newly emerging challenges with its revolutionary machine learning algorithm.
- Ultimate Printing Process Reliability & Consistency: With increasing component miniaturization, improving inspection quality, and increasing the inspection system’s throughput, programming is paramount in the industry. Our AI-powered solution not only analyzes challenges in the printing process faced today in the industry, but also is prepared to solve newly emerging challenges with its revolutionary machine learning algorithm.
- Meister S: Premium In-line 3D Inspection Systems for Ultra-thin Solder Paste Inspection
- Market-proven Ultra-thin Solder Inspection: The Meister S has been qualified for mass production by major semiconductor foundries and micro-LED companies for solder inspection down to 10um with superior True 3D inspection performance.
- Superior Flux Inspection: Combining innovative vision algorithms and high-resolution optics for the semiconductor industries, the Meister S goes beyond paste and delivers a proven solution for flux inspection.
- Meister D: The Industry’s Leading Inspection Systems for Advanced Packaging
- Crack Inspection: The Meister D is a solution targeting die and small MLCCs using an integrated measurement tool with defect analysis software based on advanced optics and AI engines. The system inspects micro cracks, chipping, foreign materials, and more.
- Crack Inspection: The Meister D is a solution targeting die and small MLCCs using an integrated measurement tool with defect analysis software based on advanced optics and AI engines. The system inspects micro cracks, chipping, foreign materials, and more.
- Zenith : The Industry’s Best Selling and First True 3D AOI Solution
- KAP (Koh Young Auto Programming): The innovative geometry-based KAP software solution reduces the programming process to minimize time to production and costs.
- Whole-board Foreign Material Inspection (WFMI): Inspection goes beyond components and solder joints. The Zenith combines 2D with True 3D to identify foreign materials such as burr, solder balls, chips, and other debris that may lead to costly field failures.
- Zenith F : The Industry’s Best-in-Class True 3D AOI Solution for FPCB Assembly
- FPCB Substrate Handling: The Zenith F is the ideal solution for high-volume FPCB inspection. Due to the thinner and pliable nature of the flexible printed circuit boards, special handling with dedicated expertise is required in comparison to traditional printed circuit boards.
- True 3D Hotbar Inspection: The Zenith F is the industry’s only solution to base its inspection criteria on the IPC-610 standards using True 3D inspection performance for hotbar soldering.
- Zenith Alpha: The Best Value High-Speed 3D Automated Optical Inspection Solution
- Enhanced 3D Measurement using Proprietary AI Technology: The Smart & Dynamic True 3D measurement inspection technology on the Zenith Alpha incorporates AI to deliver the accuracy needed for ultra-fine pitch and solder joint interreflection challenges.
- High Accuracy and Speed for Demanding Production Line: Without sacrificing accuracy and speed, the Zenith Alpha combines mechatronics technology with cutting-edge measurement capabilities to yield high throughput suitable for demanding production lines.
- KSMART Solutions: True Smart Factory Solution
- Turning Data into Insights: AI-powered KSMART solutions help automate process control while focusing on data management, analysis, and optimization. It collects data from across the factory for defect detection, real-time optimization, enhanced decisions, and traceability. This significantly improves metrics, increases quality, and lowers costs by eliminating variances, false calls, and escapes.
- Converts data into knowledge for effective and quality-driven actions
- Delivers an AI-powered process analysis and optimization tool
- Achieves an autonomous process optimization facility
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About Koh Young
Established in 2002, Koh Young pioneered the market by launching the first 3D Solder Paste Inspection (SPI) system using a patented dual-projection Moiré technology. Since then, it has become the global leader in 3D measurement-based SPI and Automated Optical Inspection (AOI) equipment for the electronics industry. Based on its True3D™ measurement-based inspection technology, Koh Young has developed new solutions for challenges with Machining Optical Inspection (MOI), Dispensing Process Inspection (DPI), and Semiconductor Packaging Inspection (MEISTER Series), as well as branching out to Medical Robotics for brain surgery (KYMERO). Through its technological innovations, Koh Young has secured thousands of global customers and maintains the largest global market share in the SPI and AOI markets. Additionally, by adopting its user-centric R&D activities, it continues to leverage core competencies and develop innovative solutions for new and existing markets. Its activities stem from the corporate headquarters in Korea to its sales and support offices in Germany, Japan, Singapore, Vietnam, Penang, China, Brazil, Argentina, Canada, Mexico, and the United States. These local facilities ensure it keeps in close contact with the market, and more importantly, its growing customer base to provide access to an award-winning network of inspection and measurement experts. Learn why so many electronics manufacturers trust Koh Young for reliable inspection at kohyoung.com.
