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SSPA 2026
Meet Koh Young Technology at SSPA 2026!
The Smart SMT & PCB Assembly Exhibition (SSPA) is a specialized event highlighting the future of electronics manufacturing, covering innovations from assembly processes to semiconductor packaging and automation systems.
At SSPA 2026, Koh Young will introduce two new AOI systems along with enhanced AI-driven smart factory solutions.
Built on high-precision inspection and AI-powered automation, our latest technologies are designed to improve manufacturing quality and enable more stable, intelligent production.
- Date: April 1 (Wed) – 3 (Fri), 2026
- Venue: Suwon Convention Center, Korea
- Booth: F102
