SEMICON West 2024
- Show Venue: Moscone Center San Francisco, CA
- Show Date: July 9-11 (Tue-Thu), 2024
- Booth No. : 1833 South Hall
- KY Solutions Highlights:
Meister S Premium In-line 3D Inspection System for Micro Solder Paste Deposits
Combining innovative vision algorithms and high-resolution optic technology, the Meister S is the ultimate, True 3D SPI solution for the semiconductor & Mini/Micro-LED packaging process improvement. ▪ High-resolution optics with a high-speed camera system (0.1 µm Z resolution)
- High-speed 25 Mega-pixel Camera with 3.5-micron Resolution Optics
- 10-micron Thins Solder Paste Inspection
- Colored and Transparent Flux Inspection
Meister D+ Breakthrough in 3D Measurement for Highly Reflective and Mirror-surfaced Components
The Meister D+ combines industry-leading Moiré technology to inspect for micro cracks, chipping, foreign material, and more and our new proprietary optics to support highly-reflective die inspection, a challenge historically plaguing the industry.
- Small Die and Component Inspection (0201 metric / 008004 EIA)
- Narrow-gap Inspection down to 50-microns
- True 3D Height and Tilt Measurement in High Density, Highly Reflective Applications
Meister W+ True 3D Measurement for Wafer Bumps & Shiny Components
Combining innovative vision algorithms and high-resolution optical technology, the Meister W+ inspects highly reflective die as well as components. With proprietary deep learning technology, it offers enhanced capabilities to inspect defects like micro-cracks, foreign material, chipping, and more.
- Industry-leading True 3D measurement capabilities enhanced by proprietary deep learning technology
- 10-micron diameter wafer bump inspection
- Revolutionary full 3D height and tilt measurement capability for even highly reflective die surfaces
Neptune C+ Award-winning True3D Underfill and Coating Inspection with Thickness Measurement
Using UV light for presence or localized thickness inspection inherently limits accuracy, and applying a traditional laser approach is all too localized and simply takes too long in a production environment. Plus, these options only provide 2D results. The revolutionary Neptune C+ provides the ultimate solution to these and more challenges.
- L.I.F.T. (Laser Interferometry for Fluid Tomography) for non-destructive inspection
- True3D measurement-based Profiling of wet or cured materials
- Measures coatings, underfill, epoxy, bonding, glue, and more
