SEMICON West 2024

  • Show Venue: Moscone Center San Francisco, CA
  • Show Date: July 9-11  (Tue-Thu), 2024
  • Booth No. :  1833 South Hall
  • KY Solutions Highlights:

 Meister S Premium In-line 3D Inspection System for Micro Solder Paste Deposits

Combining innovative vision algorithms and high-resolution optic technology, the Meister S is the ultimate, True 3D SPI solution for the semiconductor & Mini/Micro-LED packaging process improvement. ▪ High-resolution optics with a high-speed camera system (0.1 µm Z resolution)

  • High-speed 25 Mega-pixel Camera with 3.5-micron Resolution Optics
  • 10-micron Thins Solder Paste Inspection
  • Colored and Transparent Flux Inspection

Meister D+ Breakthrough in 3D Measurement for Highly Reflective and Mirror-surfaced Components

The Meister D+ combines industry-leading Moiré technology to inspect for micro cracks, chipping, foreign material, and more and our new proprietary optics to support highly-reflective die inspection, a challenge historically plaguing the industry.

  • Small Die and Component Inspection (0201 metric / 008004 EIA)
  • Narrow-gap Inspection down to 50-microns
  • True 3D Height and Tilt Measurement in High Density, Highly Reflective Applications

Meister W+ True 3D Measurement for Wafer Bumps & Shiny Components

Combining innovative vision algorithms and high-resolution optical technology, the Meister W+ inspects highly reflective die as well as components. With proprietary deep learning technology, it offers enhanced capabilities to inspect defects like micro-cracks, foreign material, chipping, and more.

  • Industry-leading True 3D measurement capabilities enhanced by proprietary deep learning technology
  • 10-micron diameter wafer bump inspection
  • Revolutionary full 3D height and tilt measurement capability for even highly reflective die surfaces

Neptune C+ Award-winning True3D Underfill and Coating Inspection with Thickness Measurement

Using UV light for presence or localized thickness inspection inherently limits accuracy, and applying a traditional laser approach is all too localized and simply takes too long in a production environment. Plus, these options only provide 2D results. The revolutionary Neptune C+ provides the ultimate solution to these and more challenges.

  • L.I.F.T. (Laser Interferometry for Fluid Tomography) for non-destructive inspection
  • True3D measurement-based Profiling of wet or cured materials
  • Measures coatings, underfill, epoxy, bonding, glue, and more


Date And Time

07-09-24 to



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