SSPA 2026

Meet Koh Young Technology at SSPA 2026!

The Smart SMT & PCB Assembly Exhibition (SSPA) is a specialized event highlighting the future of electronics manufacturing, covering innovations from assembly processes to semiconductor packaging and automation systems.

At SSPA 2026, Koh Young will introduce two new AOI systems along with enhanced AI-driven smart factory solutions.
Built on high-precision inspection and AI-powered automation, our latest technologies are designed to improve manufacturing quality and enable more stable, intelligent production.

Date: April 1 (Wed) – 3 (Fri), 2026

Venue: Suwon Convention Center, Korea

Booth: F102

Date And Time

04-01-26 to
04-03-26

Registration End Date

03-31-26

Location

Suwon Convention Center, Korea

Event Types

Exhibition

Event Category

Industrial