Atlanta, GA – Koh Young, the industry leader in True3D™ measurement-based inspection solutions, invites you to join us at the 2025 IEEE Electronic Components and Technology Conference (ECTC), taking place May 27–30, 2025, at the Gaylord Texan Resort & Convention Center in Grapevine, Texas. Now in its 75th year, ECTC is the premier international event dedicated to microelectronic packaging, components, and systems, bringing together global experts for collaboration, education, and innovation.
As the exclusive sponsor of the ECTC Gala, Koh Young is proud to continue its commitment to the advanced packaging community. The 2025 technical program features groundbreaking work in assembly and manufacturing technologies, heterogeneous integration, wafer-level packaging, and semiconductor inspection. Attendees will gain insights from industry leaders through technical sessions, panels, plenaries, and EPS seminars, as well as in the exhibition area.
The ECTC Exhibition offers a vital opportunity for engineers, technologists, and decision makers to engage directly with Koh Young and other technology leaders. Visit booth 419 to learn how our AI-powered 3D inspection solutions are solving critical challenges in advanced packaging and semiconductor applications. Our experts will be on hand to discuss how True 3D measurement and automated process control are helping manufacturers improve quality, reduce waste, and achieve zero-defect production goals.
“As advanced packaging and semiconductor technologies continue to push the limits of precision and reliability, manufacturers need inspection solutions that can keep pace,” said Brent Fischthal, Head of Global Marketing at Koh Young. “At ECTC 2025, we’re excited to connect with engineers and decision makers to explore how our AI-powered 3D metrology solutions enable smarter process control and higher yield. We’re also pleased to introduce our new sales partner, NTV USA, who will help us expand support for customers in these critical application areas.”
To register, visit www.ectc.net/registration. If you are unable to attend in person, explore our inspection innovations anytime at www.kohyoung.com.
About Koh Young Technology
Established in 2002, Koh Young revolutionized the inspection market by launching the industry’s first 3D Solder Paste Inspection (SPI) system using a patented dual-projection Moiré technology. Since then, it has become the global leader in 3D measurement-based SPI and Automated Optical Inspection (AOI) equipment for the electronics industry. Based on its True3D™ measurement-based inspection technology, Koh Young has developed innovative inspection solutions for challenges with machined parts, press-fit and through-hole pins, conformal coatings, dispensed materials, and semiconductor packages. Through its constant innovation, Koh Young has secured over 3,800 global customers, and commands the dominant global market share position in the SPI and AOI markets with well over 24,000 machine installations. A customer-centric R&D focus uses our core competencies to develop innovative solutions for new and existing markets by listening to users and researching trends and applications. From the headquarters in Korea, activities spread across the world through its global sales and support infrastructure spanning Europe, Asia, and the Americas. These regional offices ensure Koh Young stays close to the market, and more importantly, its growing user base. Learn why so many electronics manufacturers trust Koh Young for reliable inspection at our website at www.kohyoung.com.
