[US-TECH] Koh Young to Unveil Next-Generation Inspection and Smart AI Solutions at NEPCON Asia 2026
[US-TECH] Koh Young Earns its Fifth Service Excellence Award
Customer Confidence Earns Koh Young Another Service Excellence Award from Circuits Assembly

Press Release Absolute No.1 Inspection Company Customer Confidence Earns Koh Young Another Service Excellence Award from Circuits Assembly Atlanta, Georgia – Customer confidence has once again earned Koh Young America a Service Excellence Award from Circuits Assembly, marking its fifth win in six years of participation. Since entering the program for the first time in […]
[US-TECH] Koh Young Hires Western Regional Sales Manager
[US-TECH] Koh Young Demos Inspection & Metrology Solutions
Koh Young Brings Advanced Packaging Inspection and Metrology Solutions to SEMICON West 2026
Press Release Absolute No.1 Inspection Company Koh Young Brings Advanced Packaging Inspection and Metrology Solutions to SEMICON West 2026 Atlanta, Georgia – Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions, will showcase its growing portfolio of inspection and metrology technologies for semiconductor and advanced packaging applications at SEMICON West 2026, October 13–15 […]
Koh Young Hires Brent Johnson as Western Regional Sales Manager

Press Release Absolute No.1 Inspection Company Koh Young Hires Brent Johnson as Western Regional Sales Manager Manufacturing veteran brings hands-on SMT process and Koh Young inspection experience to the regional sales team Duluth, Georgia – Koh Young America has hired Brent Johnson as Western Regional Sales Manager, adding an experienced SMT manufacturing professional with firsthand […]
[US-TECH] Koh Young Participates in EPS 2026
Koh Young Advances the Measurement Conversation at Electronics Packaging Symposium 2026

Press Release Absolute No.1 Inspection Company Koh Young Advances the Measurement Conversation at Electronics Packaging Symposium 2026 Advanced packaging portfolio addresses increasingly diverse chiplet, heterogeneous integration, and wafer-level manufacturing challenges Atlanta, Georgia – Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions, will participate in the 37th Annual Electronics Packaging Symposium (EPS), September […]
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