Koh Young 8030 USX SPI for Ultra Large, Heavy Boards Wins the Global Technology Award at Productronica
Atlanta, Georgia – Koh Young Technology, the leader in True3D™ measurement-based inspection solutions, proudly announced the USX Series of inspection machines for ultra large and heavy boards wins another innovation award. This time, Global SMT & Packaging acknowledged the new 8030 USX SPI, part of the USX series of inspection machines designed for applications like […]
Koh Young Showing PCBA and Semiconductor Inspection Innovations at Productronica on November 14-17, 2023 at Messe München
Alzenau, Germany – Koh Young, the industry leader in True 3D measurement-based inspection solutions, will highlight live demonstrations of its award-winning inspection and measurement solutions for printed circuit board, advanced packaging, and semiconductor assembly at Productronica, the highly-anticipated trade fair in Messe München on November 14-17, 2023 in Munich, Germany. Koh Young will have two […]
