Tag: 2026

Koh Young Advances the Measurement Conversation at Electronics Packaging Symposium 2026

Koh Young Highlighting Dimensional Metrology Inspection Solutions at the Binghamton University Electronics Packaging Symposium in Niskayuna NY.jpg

Press Release Absolute No.1 Inspection Company Koh Young Advances the Measurement Conversation at Electronics Packaging Symposium 2026 Advanced packaging portfolio addresses increasingly diverse chiplet, heterogeneous integration, and wafer-level manufacturing challenges Atlanta, Georgia – Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions, will participate in the 37th Annual Electronics Packaging Symposium (EPS), September […]

Koh Young Technology to Double Production Capacity as AI Server and Advanced Semiconductor Demand Grows

Press Release Absolute No.1 Inspection Company Koh Young Technology to Double Production Capacity as AI Server and Advanced Semiconductor Demand Grows New 12,800-square-meter production center will support rising demand from AI server and advanced semiconductor markets while creating capacity for future growth Seoul, Korea – Koh Young Technology, the industry leader in True3D™ measurement-based inspection […]

Koh Young Turns Measurement-based Inspection Data into Manufacturing Intelligence at SMTA International 2026

Press Release Absolute No.1 Inspection Company Koh Young Turns Measurement-based Inspection Data into Manufacturing Intelligence at SMTA International 2026 Smart AI Solutions combine trusted True3D measurement data, artificial intelligence, and process optimization to improve production decisions Atlanta, Georgia – Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions, will showcase its latest inspection […]