[I-Connect007] The Printed Circuit Assembler’s Guide to… ™ SMT Inspection: Today, Tomorrow, and Beyond

Book

by: Brent Fischthal SMT Inspection from I-Connect007 https://iconnect007.com/my-i-connect007/books/inspection/ Currently, surface mount technology lines are monitored by two key inspection processes. The first, SPI, reviews the printed circuit board after the solder paste has been applied and before components are placed. The second, AOI, reviews the PCB assembly after the board has been assembled and reflowed […]

Koh Young Speaking about Creating a Smart Factory at PCB West 2022

PCB West 2022

Atlanta, Georgia – Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will explain how electronics manufacturers can leverage the IPC-CFX machine communication standard to integrate process equipment and create a smart factory at PCB West on 05 October 2022 at the Santa Clara Convention Center in California. Leveraging IPC-CFX, Koh Young […]