[I-Connect007] The Printed Circuit Assembler’s Guide to… ™ SMT Inspection: Today, Tomorrow, and Beyond
by: Brent Fischthal SMT Inspection from I-Connect007 https://iconnect007.com/my-i-connect007/books/inspection/ Currently, surface mount technology lines are monitored by two key inspection processes. The first, SPI, reviews the printed circuit board after the solder paste has been applied and before components are placed. The second, AOI, reviews the PCB assembly after the board has been assembled and reflowed […]
[I-Connect007] On-Demand: Free 12-part Webinar Series – Converting Process Data Into Intelligence
with experts Joel Scutchfield and Ivan Aduna https://iconnect007.com/my-i-connect007/webinars/processdata
Koh Young Speaking about Creating a Smart Factory at PCB West 2022
Atlanta, Georgia – Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will explain how electronics manufacturers can leverage the IPC-CFX machine communication standard to integrate process equipment and create a smart factory at PCB West on 05 October 2022 at the Santa Clara Convention Center in California. Leveraging IPC-CFX, Koh Young […]