[I-Connect007] The Printed Circuit Assembler’s Guide to… ™ SMT Inspection: Today, Tomorrow, and Beyond
by: Brent Fischthal SMT Inspection from I-Connect007 https://iconnect007.com/my-i-connect007/books/inspection/ Currently, surface mount technology lines are monitored by two key inspection processes. The first, SPI, reviews the printed circuit board after the solder paste has been applied and before components are placed. The second, AOI, reviews the PCB assembly after the board has been assembled and reflowed […]
Koh Young highlighting Award-winning True3D™ Inspection Solutions at SMTA Guadalajara Expo 21-22 September 2022
Atlanta, Georgia – Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will deliver live demonstrations of its award-winning inspection and measurement solutions during the live tradeshow at EXPO Guadalajara in Jalisco, Mexico during September 21-22, 2022. The following is just a glimpse into what Koh Young has in store for our visitors: […]
