{"id":20093,"date":"2026-04-22T16:11:08","date_gmt":"2026-04-22T07:11:08","guid":{"rendered":"https:\/\/kohyoung.com\/en\/?p=20093"},"modified":"2026-04-30T16:23:11","modified_gmt":"2026-04-30T07:23:11","slug":"koh-young-technology-brings-proven-3d-metrology-expertise-to-the-advanced-packaging-stage-at-ectc-2026","status":"publish","type":"post","link":"https:\/\/kohyoung.com\/en\/koh-young-technology-brings-proven-3d-metrology-expertise-to-the-advanced-packaging-stage-at-ectc-2026\/","title":{"rendered":"Koh Young Technology Brings Proven 3D Metrology Expertise to the Advanced Packaging Stage at ECTC 2026"},"content":{"rendered":"\t\t
\n\t\t\t\t\t\t
\n\t\t\t\t\t\t\t
<\/div>\n\t\t\t\t\t\t\t
\n\t\t\t\t\t
\n\t\t\t
\n\t\t\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t

Press Release<\/p>\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

\n\t\t\t\t
\n\t\t\t\t\t\t\t

Absolute No.1 Inspection Company<\/p>\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

\n\t\t\t\t\t\t
\n\t\t\t\t\t
\n\t\t\t
\n\t\t\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t
\n\t\t\t
<\/div>\n\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
\n\t\t\t\t\t\t
\n\t\t\t\t\t
\n\t\t\t
\n\t\t\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t

Koh Young Technology Brings Proven 3D Metrology Expertise <\/strong><\/p>

to the Advanced Packaging Stage at ECTC 2026<\/strong><\/p>\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

\n\t\t\t\t\t\t
\n\t\t\t\t\t
\n\t\t\t
\n\t\t\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t
\n\t\t\t\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
\n\t\t\t\t\t\t
\n\t\t\t\t\t
\n\t\t\t
\n\t\t\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t
\"\"<\/a>
\u00a0<\/div><\/div>

Atlanta, GA<\/em>\u00a0\u2014 Koh Young, the industry leader in True3D\u2122 measurement-based\u00a0inspection solutions<\/a>, is bringing its battle-tested platform to where that challenge is being solved at the 2026 IEEE Electronic Components and Technology Conference (ECTC), May 26\u201329, at the JW Marriott & The Ritz-Carlton Grande Lakes in Orlando, Florida. The advanced packaging industry is demanding a level of inspection precision that traditional metrology simply cannot deliver, and Koh Young is ready to meet that moment.<\/p>

A Proven Platform. A New Frontier.<\/strong><\/h2>

Koh Young\u2019s True3D\u2122 technology didn\u2019t become the global standard in electronics manufacturing inspection by accident. It earned that position by delivering measurement accuracy, process intelligence, and yield improvements that manufacturers could measure and depend on. Now, that same platform is being applied to the complexity of advanced packaging, including heterogeneous integration, wafer-level packaging, and\u00a0semiconductor inspection<\/a>, where the margin for error is even smaller and the cost of failure even greater.<\/p>

As the exclusive sponsor of the ECTC Gala, Koh Young is making a clear statement: this community matters, and we are here for the long term. The 2026 technical program spans assembly and manufacturing technologies, heterogeneous integration, wafer-level packaging, and\u00a0semiconductor inspection<\/a>, reflecting exactly the challenges our solutions are engineered to address.<\/p>

See It for Yourself at Booth 208<\/strong><\/h2>

Talk is cheap. At Booth 208, Koh Young\u2019s specialists will show, not just tell, how\u00a0AI-powered 3D inspection<\/a>\u00a0is solving real problems in advanced packaging production. See how True3D\u2122 measurement and automated process control help manufacturers improve quality, reduce waste, and build toward zero-defect production. If you\u2019re wrestling with yield loss, process drift, or inspection gaps in your advanced packaging line, this is a conversation worth having.<\/p>

Making the Case for a New Standard<\/strong><\/h2>

\u201cAdvanced packaging is pushing the boundaries of what inspection and metrology have traditionally been asked to do,\u201d said Joel Scutchfield, General Manager of Surface Mount & Advanced Packaging Operations at Koh Young America. \u201cWe built the inspection standard in SMT by delivering measurement accuracy and process intelligence that manufacturers could actually depend on. Now we\u2019re bringing that same rigor and commitment to zero-defect manufacturing to advanced packaging. ECTC 2026 is where we make that case directly to the engineers and decision-makers who need it most.\u201d<\/p>

Join the Conversation<\/strong><\/h2>

Register for ECTC 2026 and make Booth 208 a priority stop. To learn more about Koh Young\u2019s inspection solutions for advanced packaging and semiconductor applications, visit\u00a0www.kohyoung.com.<\/a><\/p><\/div><\/div><\/div>\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

\n\t\t\t\t\t\t
\n\t\t\t\t\t
\n\t\t\t
\n\t\t\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t
\n\t\t\t\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t

About Koh Young Technology, Inc.<\/strong><\/h4>

Founded in 2002, Koh Young pioneered the industry\u2019s first\u00a03D Solder Paste Inspection (SPI)<\/a>\u00a0system using patented dual projection Moir\u00e9 technology. Today, it leads the market in 3D SPI and\u00a0Automated Optical Inspection (AOI)<\/a>\u00a0solutions, with over 26,500 systems installed globally at over 4,100 customers. Koh Young\u2019s True 3D technology addresses challenges in electronics manufacturing including surface mount, through-hole, pin insertion, conformal coating, machined parts, semiconductor wafers, and advanced packaging. Guided by user-focused R&D, the company continues to innovate and address evolving market needs. With headquarters in Korea and regional offices worldwide, Koh Young remains close to its customers, delivering trusted solutions for\u00a0smart manufacturing<\/a>. Visit\u00a0www.kohyoung.com<\/a>\u00a0to learn more.<\/p>

\u00a0<\/p>\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

\n\t\t\t\t\t\t
\n\t\t\t\t\t
\n\t\t\t
\n\t\t\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t
\n\t\t\t
<\/div>\n\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t
\n\t\t\t
<\/div>\n\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"

Press Release Absolute No.1 Inspection Company Koh Young Technology Brings Proven 3D Metrology Expertise to the Advanced Packaging Stage at ECTC 2026 \u00a0 Atlanta, GA\u00a0\u2014 Koh Young, the industry leader in True3D\u2122 measurement-based\u00a0inspection solutions, is bringing its battle-tested platform to where that challenge is being solved at the 2026 IEEE Electronic Components and Technology Conference […]<\/p>\n","protected":false},"author":1,"featured_media":18359,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":"","_links_to":"","_links_to_target":""},"categories":[49,51],"tags":[280,155,212,157],"class_list":["post-20093","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-event-news","category-press-release","tag-280","tag-ectc","tag-kya","tag-usa"],"_links":{"self":[{"href":"https:\/\/kohyoung.com\/en\/wp-json\/wp\/v2\/posts\/20093","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/kohyoung.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/kohyoung.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/kohyoung.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/kohyoung.com\/en\/wp-json\/wp\/v2\/comments?post=20093"}],"version-history":[{"count":7,"href":"https:\/\/kohyoung.com\/en\/wp-json\/wp\/v2\/posts\/20093\/revisions"}],"predecessor-version":[{"id":20100,"href":"https:\/\/kohyoung.com\/en\/wp-json\/wp\/v2\/posts\/20093\/revisions\/20100"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/kohyoung.com\/en\/wp-json\/wp\/v2\/media\/18359"}],"wp:attachment":[{"href":"https:\/\/kohyoung.com\/en\/wp-json\/wp\/v2\/media?parent=20093"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/kohyoung.com\/en\/wp-json\/wp\/v2\/categories?post=20093"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/kohyoung.com\/en\/wp-json\/wp\/v2\/tags?post=20093"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}