The World Best 3D AOI with Incomparable Performance
The Zenith series 3D AOI systems measure the true profilometric shape of components, solder joints, patterns and even foreign material on assembled PCBs with true 3 dimensional measurement, overcoming the shortcomings and vulnerabilities of 2D AOI.
Benefits of 3D Measurement for Assembled PCBs
In the absence of true measurement data, inspection is subjective.
Zenith performs 3D measurement and is indifferent to any PCB/component environment variations.
Shiny solder joints produce specular reflections and sensor saturation in conventional inspection.
ZENITH performs volumetric measurement of the solder joint.
Conventional AOI systems can not inspect components shadowed by tall neighboring components reliably. ZENITH has the ability to measure accurately even in shaded areas
ZENITH provides a large height measurement range without compromising Z-resolution, delivering an industry first 3D image accuracy and quality.
Intuitive and Accurate Defect Judgment based on Measurement Values