Koh Young Technology provides wide range of 3D measurement and inspection solutions to a diversified customer base in different industry sectors including electronics assembly and semiconductor packaging for
mobile, automotive, aerospace, military, medical, telecommunications, consumer electronics and mixed EMS.
We have maintained strong market leader’s position in Solder Paste Inspection(SPI) market since 2006, now occupying nearly 50% of the whole market. Shortly after introducing the world first 3D AOI system to the SMT market, Koh Young became the market leader in the total SMT inspection market.
Koh Young’s position will be strengthened by pursuing technology leadership and innovative ideas into solutions for customers, not by pursuing increase in market share.